Fraunhofer-Institut für Sichere Informationstechnologie- Registration Authority: ISO/IEC JTC1/SC17
- Orginalliste der Chiphersteller-Kennungen (Stand: März 2018)
Definition des Datenobjektes Integrated Circuit Manufacturer Identifier
in ISO/IEC 7816-6
| ICM ID | Integrated Circuit Manufacturer (ICM) |
|---|---|
| '01' | Motorola (UK) |
| '02' | STMicroelectronics SA (FR) |
| '03' | Hitachi Ltd (JP) |
| '04' | NXP Semiconductors (DE) |
| '05' | Infineon Technologies AG (DE) |
| '06' | Cylink (US) |
| '07' | Texas Instruments (FR) |
| '08' | Fujitsu Limited (JP) |
| '09' | Matsushita Electronics Corporation, Semiconductor Company (JP) |
| '0A' | NEC (JP) |
| '0B' | Oki Electric Industry Co Ltd (JP) |
| '0C' | Toshiba Corp (JP) |
| '0D' | Mitsubishi Electric Corp (JP) |
| '0E' | Samsung Electronics Co Ltd (KR) |
| '0F' | Hynix (KR) |
| '10' | LG-Semiconductors Co Ltd (KR) |
| '11' | Emosyn-EM Microelectronics (US) |
| '12' | INSIDE Technology (FR) |
| '13' | ORGA Kartensysteme GmbH (DE) |
| '14' | Sharp Corporation (JP) |
| '15' | ATMEL (FR) |
| '16' | EM Microelectronic-Marin (CH) |
| '17' | SMARTRAC TECHNOLOGY GmbH (DE) |
| '18' | ZMD AG (DE) |
| '19' | XICOR Inc (US) |
| '1A' | Sony Corporation (JP) |
| '1B' | Malaysia Microelectronic Solutions Sdn Bhd (MY) |
| '1C' | Emosyn (US) |
| '1D' | Shanghai Fudan Microelectronics Co Ltd (CN) |
| '1E' | Magellan Technology Pty Limited (AU) |
| '1F' | Melexis NV BO (CH) |
| '20' | Renesas Technology Corp (JP) |
| '21' | TAGSYS (FR) |
| '22' | Transcore (US) |
| '23' | Shanghai Belling Corp Ltd (CN) |
| '24' | Masktech Germany GmbH (DE) |
| '25' | Innovision Research and Technology Plc (UK) |
| '26' | Hitachi ULSI Systems Co Ltd (JP) |
| '27' | Yubico AB (SE) |
| '28' | Ricoh (JP) |
| '29' | ASK (FR) |
| '2A' | Unicore Microsystems LLC (RU) |
| '2B' | Dallas semiconductor/Maxim (US) |
| '2C' | Impinj Inc (US) |
| '2D' | RightPlug Alliance (US) |
| '2E' | Broadcom Corporation (US) |
| '2F' | MStar Semiconductor Inc (TW) |
| '30' | BeeDar Technology Inc (US) |
| '31' | RFIDsec (DK) |
| '32' | Schweizer Electronic AG (DE) |
| '33' | AMIC Technology Corp (TW) |
| '34' | Mikron JSC (RU) |
| '35' | Fraunhofer Institute for Photonic Microsystems (DE) |
| '36' | IDS Microship AG (CH) |
| '37' | Kovio (US) |
| '38' | HMT Microelectronic Ltd (CH) |
| '39' | Silicon Craft Technology (TH) |
| '3A' | Advanced Film Device Inc. (JP) |
| '3B' | Nitecrest Ltd (UK) |
| '3C' | Verayo Inc. (US) |
| '3D' | HID Global (US) |
| '3E' | Productivity Engineering Gmbh (DE) |
| '3F' | Austriamicrosystems AG (reserved) (AT) |
| '40' | Gemalto SA (FR) |
| '41' | Renesas Electronics Corporation (JP) |
| '42' | 3Alogics Inc (KR) |
| '43' | Top TroniQ Asia Limited (Hong Kong) |
| '44' | Gentag Inc (USA) |
| '45' | Invengo Information Technology Co.Ltd (CN) |
| '46' | Guangzhou Sysur Microelectronics, Inc (CN) |
| '47' | CEITEC S.A. (BR) |
| '48' | Shanghai Quanray Electronics Co. Ltd. (CN) |
| '49' | MediaTek Inc (TW) |
| '4A' | Angstrem PJSC (RU) |
| '4B' | Celisic Semiconductor (Hong Kong) Limited (CN) |
| '4C' | LEGIC Identsystems AG (CH) |
| '4D' | Balluff GmbH (DE) |
| '4E' | Oberthur Technologies (FR) |
| '4F' | Silterra Malaysia Sdn. Bhd. (MY) |
| '50' | DELTA Danish Electronics, Light & Acoustics (DK) |
| '51' | Giesecke & Devrient GmbH (DE) |
| '52' | Shenzhen China Vision Microelectronics Co., Ltd. (CN) |
| '53' | Shanghai Feiju Microelectronics Co. Ltd. (CN) |
| '54' | Intel Corporation (US) |
| '55' | Microsensys GmbH (DE) |
| '56' | Sonix Technology Co., Ltd. (TW) |
| '57' | Qualcomm Technologies Inc (US) |
| '58' | Realtek Semiconductor Corp (TW) |
| '59' | Freevision Technologies Co. Ltd (CN) |
| '5A' | Giantec Semiconductor Inc. (CN) |
| '5B' | JSC Angstrem-T (RU) |
| '5C' | STARCHIP France |
| '5D' | SPIRTECH (FR) |
| '5E' | GANTNER Electronic GmbH (AT) |
| '5F' | Nordic Semiconductor (NO) |
| '60' | Verisiti Inc (US) |
| '61' | Wearlinks Technology Inc. (CN) |
| '62' | Userstar Information Systems Co., Ltd (TW) |
| '63' | Pragmatic Printing Ltd. (UK) |
| '64' | Associação do Laboratório de Sistemas Integráveis Tecnológico – LSI-TEC (BR) |
| '65' | Tendyron Corporation (CN) |
| '66' | MUTO Smart Co., Ltd.(KR) |
| '67' | ON Semiconductor (US) |
| '68' | TÜBİTAK BİLGEM (TR) |
| '69' | Huada Semiconductor Co., Ltd (CN) |
| '6A' | SEVENEY (FR) |
| '6B' | ISSM (FR) |
| '6C' | Wisesec Ltd (IL) |
| '7E' | Holtek (TW) |